The team has mentioned we will absolutely help customers who experience the housing cracking issue.
That issue and the issue with the housing mating points on some of the assemblies was due to the cooling and deburring process not the thickness of the plastic. The actual percentage of devices with that issue is quite small.
It’s not as simple as saying it’s too thin and should be thicker or a different formulation etc. Much thicker plastic when brittle would still crack. As someone who’s been in the electronic device manufacturing business a long time the choice of plastic, mating method and thickness are clearly ok. It’s not a low cost material. The plastic formulation used just has a small thermal envelope for the cooling process and a very specific deburring process. If the cooling envelope is just slightly off then a quick deburring process can cause a microfracture. Some injection mold plastics firms have special scanning equipment that search for that type of fracture. One small piece of advice don’t try to repair this type of plastic with superglue, it will annihilate this formulation.
Just my .02c